Immunity Features

  • Immunity Features

Current Spread Path Scan

  • Trace current paths by visualizing current diffusion

The Current Spread Path Scan reproduces diffusion currents, which are one of the factors that can lead to ESD-induced failures or malfunctions. This feature allows visualization of the current flow within the DUT. While measuring the magnetic field in the scan area in the time domain with an oscilloscope, the current applied to specific points on the DUT is recorded and then converted into surface current density during post-processing, producing a visual representation of the current flow. This function is primarily intended for visualizing current distribution rather than for quantitative analysis.

See also: “Introduction to Current Spread Path Scan (Video / English)”.

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Use Cases

  • Evaluating and determining optimal placement of clamping devices
  • Comparing performance of different clamping devices
  • Identifying and mitigating unintended current paths
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The figure above shows a comparison of TVS diodes from different manufacturers on the same PCB. This allows performance comparisons across devices, specifications, and manufacturers. By combining Current Spread Path Scan with ESD Scan, you can gain deeper insights into DUT behavior and the root causes of malfunctions or failures during ESD testing.

Required Equipment

  • SmartScan-CS (software)
  • Probe (e.g., API Standard Probe Hx-2mm)
  • TLP (Transmission Line Pulse)
  • Oscilloscope (≥2 GHz, ≥20 GS/s)

Please also see our Rohde & Schwarz products

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Immunity Features

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